Intel announced Wednesday that crews have installed the first major structural truss at the Ohio site, signalling that the next phase of construction has begun. "This represents another significant step toward expanded U.S. leading-edge semiconductor capacity," said Naga Chandrasekaran, head of Intel Foundry, in a company blog post.
The milestone comes amid a broader recalibration of Intel's foundry ambitions. When the project was announced in 2022, it was expected to be operational by 2025. That timeline has been pushed back, with a second Ohio fab now planned for completion in 2031. The delay coincides with surging demand for advanced chips driven by artificial intelligence, and with customers struggling to secure capacity at Taiwan Semiconductor Manufacturing Co. (TSMC), the dominant manufacturer.
Intel has yet to land a major external customer for its most advanced 18A chips, which are currently in high-volume production at its Arizona factory and are being used for Intel's own processors. In September, reports emerged that SK Hynix, the world's leading maker of high-bandwidth memory, could lease space at the Ohio site, but neither company has confirmed any plans.
Industry analysts see a potential opening for Intel. "People want a second source to be able to twist TSMC's arm and keep them honest on pricing," said Dan Hutcheson of TechInsights, adding that "all the big ones have been testing there." Mizuho Securities analyst Jordan Klein noted that even for large chipmakers like Nvidia, AMD, Apple and Broadcom, competition for TSMC's production lines is extremely fierce.
Intel's foundry business has been central to its turnaround following delays with its 7- and 10-nanometer nodes, which contributed to a difficult 2024. Chandrasekaran also announced that operations at Intel's next fab in Arizona are expected to begin by the end of 2028.
