GlobalFoundries targets 2028 production for FDX Fusion process it pitches as 7nm-class without EUV
Planar FD-SOI process aims for 8nm-class logic density and 7nm-class power and performance, with high-volume manufacturing planned for 2030
GlobalFoundries has detailed plans for FDX Fusion, a manufacturing process that it says will deliver 7nm-class power and performance using planar FD-SOI transistors and no EUV lithography, with initial customer production targeted for 2028. In an interview with Tom's Hardware, the company's vice president of its FD-SOI business unit, Sudipto Bose, said the process offers 8nm-class logic density and set 2030 as the target for high-volume manufacturing.